{"product_id":"9781461349778","title":"Foldable Flex And Thinned Silicon Multichip Packaging Technology (Emerging Technology In Advanced Packaging, 1)","description":"Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1\/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cul\u003e\n\u003cli\u003e• \u003cb\u003eAuthor: \u003c\/b\u003eJohn W. Balde\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003ePublisher: \u003c\/b\u003eSpringer\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003ePublication Date: \u003c\/b\u003eFeb 23, 2014\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eNumber of Pages: \u003c\/b\u003e366 pages\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eLanguage: \u003c\/b\u003eEnglish\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eBinding: \u003c\/b\u003ePaperback\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eISBN-10: \u003c\/b\u003e146134977X\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eISBN-13: \u003c\/b\u003e9781461349778\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Springer","offers":[{"title":"Default Title","offer_id":50130590204209,"sku":"9781461349778","price":200.49,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0798\/8215\/8385\/files\/9781461349778.jpg?v=1728585865","url":"https:\/\/www.recomparo.com\/es\/products\/9781461349778","provider":"ReComparo.com","version":"1.0","type":"link"}