{"product_id":"9781489983244","title":"Rf And Microwave Microelectronics Packaging","description":"RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical\/RF\/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF\/MW packaging-related fields.\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cul\u003e\n\u003cli\u003e• \u003cb\u003eAuthor: \u003c\/b\u003eKen Kuang, Franklin Kim, Sean S. Cahill\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003ePublisher: \u003c\/b\u003eSpringer\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003ePublication Date: \u003c\/b\u003eSep 05, 2014\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eNumber of Pages: \u003c\/b\u003e301 pages\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eLanguage: \u003c\/b\u003eEnglish\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eBinding: \u003c\/b\u003ePaperback\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eISBN-10: \u003c\/b\u003e1489983244\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eISBN-13: \u003c\/b\u003e9781489983244\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Springer","offers":[{"title":"Default Title","offer_id":50135554392369,"sku":"9781489983244","price":200.49,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0798\/8215\/8385\/files\/9781489983244.jpg?v=1728724801","url":"https:\/\/www.recomparo.com\/es\/products\/9781489983244","provider":"ReComparo.com","version":"1.0","type":"link"}