{"product_id":"9781461492627","title":"Packaging Of High Power Semiconductor Lasers (Micro- And Opto-Electronic Materials, Structures, And Systems)","description":"This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cul\u003e\n\u003cli\u003e• \u003cb\u003eAuthor: \u003c\/b\u003eXingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003ePublisher: \u003c\/b\u003eSpringer\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003ePublication Date: \u003c\/b\u003eJul 15, 2014\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eNumber of Pages: \u003c\/b\u003e417 pages\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eLanguage: \u003c\/b\u003eEnglish\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eBinding: \u003c\/b\u003eHardcover\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eISBN-10: \u003c\/b\u003e1461492629\u003c\/li\u003e\n\u003cli\u003e• \u003cb\u003eISBN-13: \u003c\/b\u003e9781461492627\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Springer","offers":[{"title":"Default Title","offer_id":49686573318449,"sku":"9781461492627","price":234.97,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0798\/8215\/8385\/files\/9781461492627_p0_v1_s600x595.jpg?v=1721534338","url":"https:\/\/www.recomparo.com\/products\/9781461492627","provider":"ReComparo.com","version":"1.0","type":"link"}