Springer
Packaging Of High Power Semiconductor Lasers (Micro- And Opto-Electronic Materials, Structures, And Systems)
Packaging Of High Power Semiconductor Lasers (Micro- And Opto-Electronic Materials, Structures, And Systems)
ISBN-13: 9781461492627
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This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
- • Author: Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
- • Publisher: Springer
- • Publication Date: Jul 15, 2014
- • Number of Pages: 417 pages
- • Language: English
- • Binding: Hardcover
- • ISBN-10: 1461492629
- • ISBN-13: 9781461492627
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