Rf And Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

• • Author: Ken Kuang, Franklin Kim, Sean S. Cahill
• • Publisher: Springer
• • Publication Date: Sep 05, 2014
• • Number of Pages: 301 pages
• • Language: English
• • Binding: Paperback
• • ISBN-10: 1489983244
• • ISBN-13: 9781489983244